Method of sorting semiconductor lasers

ABSTRACT

It is an object to provide a method of sorting semiconductor lasers, capable of appropriately removing semiconductor lasers which can cause a so-called sudden death in use. After a first current within a range of 50 to 150% the maximum rated current is supplied to the semiconductor lasers for a predetermined period of time, a second current is supplied within a range of 120 to 250% the maximum rated current for a short period of time. Semiconductor lasers which are destroyed or degraded in output characteristics are removed as defective devices.

This application claims priority benefits under 35 U.S.C. §120, as acontinuation in part, based on U.S. patent application Ser. No.08/268,534, filed on Jul. 6, 1994 U.S. Pat. No. 5,446,537.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a method of sortingnon-defective/defective semiconductor lasers and, more particularly, toa sorting method appropriately used for semiconductor lasers having aGaInAs active layer and emitting a light with a oscillating wavelengthof about 0.98 μm.

2. Related Background Art

A semiconductor laser having a GaInAs active layer and emitting a lightwith a oscillating wavelength of about 0.98 μm is desired to be put topractical use as an exciting light source of an Er-doped optical fiberamplifier. For this purpose, defective devices must be appropriatelyremoved. As a sorting method of removing defective semiconductor lasers,a so-called accelerated test is generally used. In this method, acurrent larger than that in actual use is supplied for a predeterminedperiod of time to remove initial detects. To acknowledge the initialdefects, for example, a method on the basis of a change in thresholdcurrent before and after the accelerated test is used (Japanese PatentPublication No. 1-52912).

In the semiconductor lasers having a GaInAs active layer, however, rapiddegradation occurs from one point during energization so that thesemiconductor lasers reach a destruction state, i.e., a so-called suddendeath is observed even in devices determined to be non-defective by theconventional accelerated test. That is, although the devices seem tohave the same characteristics as those of a normal sample withoutexhibiting an increase in driving current to that point, they aresuddenly degraded. Because of the high probability of such a suddendeath in use, the GaInAs semiconductor lasers have not been widely usedyet.

SUMMARY OF THE INVENTION

It is an object of the present invention to provide a sorting methodcapable of appropriately removing defective semiconductor lasers whichcome to a sudden death in use.

In order to achieve the above object, according to the presentinvention, there is provided a method of sorting semiconductor lasers,comprising

the first step of supplying a first current within a range of 50 to 150%a maximum rated current to the semiconductor lasers for at least 50hours,

the second step of supplying a second current larger than the firstcurrent within a range of 120 to 250% the maximum rated current for atleast 1 micro-second after the first step, and

the third step of measuring light output characteristics after thesecond step and removing defective devices in accordance with ameasurement result.

According to the present invention, there is also provided a method ofsorting semiconductor lasers, comprising

the first step of causing the semiconductor lasers to output a firstlight output within a range of 50 to 150% a maximum rated light outputfor at least 50 hours,

the second step of causing the semiconductor lasers to output a secondlight output larger than the first light output within a range of 120 to250% the maximum rated light output for at least 1 micro-second afterthe first step, and

the third step of measuring light output characteristics after thesecond step and removing defective devices in accordance with ameasurement result.

In both the sorting methods, the ambient temperature during supplyingthe first current or outputting the first light output is preferablyhigher than room temperature (25° C.).

According to the studies of the present inventors, the sudden death of aGaInAs semiconductor laser is caused due to melting of an end face. Thisis called so-called catastrophic optical damage (COD) and assumed to becaused by the interaction of the light and the current at the end face.Although the semiconductor laser is operated at a predetermined densityof light, the COD occurs at one point during energization because theCOD level (light output value at which the COD occurs) is decreasedduring energization. When the COD level is decreased to the light outputvalue in the energization conditions in use, a sudden death occurs.

According to the present invention, the first current within a range of50 to 150% the maximum rated current is supplied for a predeterminedperiod of time to forcibly decrease the COD level with this operation,the difference in the COD level between a non-defective device and adefective device is increased. In the non-defective device, the CODlevel is only slightly decreased, and the COD level is kept relativelyhigh even after the first current is supplied. However, in the defectivedevice, the COD level is low from the beginning, or although the CODlevel is originally high, it is largely decreased. The COD level of thedefective device after the first current is supplied is thus much lowerthan that of the non-defective device. In this state, when the secondcurrent is instantaneously supplied, almost all of the defective devicesare destroyed. Since the second current is supplied for a very shortperiod of time, the COD level of the non-defective devices is hardlydecreased.

Another embodiment of the method according to the invention includes afirst step wherein a first predetermined current is supplied to thesemiconductor laser for a first predetermined time. Thereafter, in asecond step, the semiconductor lasers produce a first light outputhaving a first predetermined intensity. This predetermined intensity islarger than light intensity of the semiconductor lasers which isobtained in the first step, and the second step lasts for a secondpredetermined time which is shorter than the first predetermined time ofthe first step. The light output characteristics are measured in a thirdstep, which takes place after the second step. Defective semiconductorlaser devices are remove based on the measurement results in the thirdstep.

It is preferred that in the second step according to this embodiment ofthe present invention, when the first light output is output, arelationship between a supplied current and the light output ismeasured. This measurement result is used as the light outputcharacteristic which is measured in the third step. In the third step, asecond predetermined current is supplied to the semiconductor laser.Defective lasers are identified and removed when the light output value,as measured in the third step, is smaller than a predetermined value.

Another embodiment of the method of sorting semiconductor laseraccording to the invention includes a first step wherein thesemiconductor lasers produce a first light output having a firstdetermined intensity for a first predetermined time. Thereafter, a firstpredetermined current is supplied to the semiconductor lasers in asecond step. This first predetermined current is larger than a currentenabling the semiconductor lasers to issue the first predeterminedintensity. In accordance with this embodiment of the invention, thesecond step lasts for second predetermined time when is shorter than thefirst predetermined time of the first step. In a third step, the lightoutput characteristics after the second step are measured, and defectivedevices are removed in accordance with the measured results.

As in the previous embodiment, the second step preferably includes astep for measuring a relationship between the supplied current and thelight output. These measurement results are used as the light outputcharacteristic to be measured in the third step. In the third step, asecond predetermined current is applied to the semiconductor lasers.Defective semiconductor lasers are identified and removed when a lightoutput during the third step is smaller than a predetermined value.

In both of these embodiments, it is preferred if the ambient temperaturein the first step is higher than room temperature (e.g., 25° C. orhigher). Preferably, the ambient temperature in the second step is lowerthan the ambient temperature in the first step.

The present invention will become more fully understood from thedetailed description given hereinbelow and the accompanying drawingswhich are given by way of illustration only, and thus are not to beconsidered as limiting the present invention.

Further scope of applicability of the present invention will becomeapparent from the detailed description given hereinafter. However, itshould be understood that the detailed description and specificexamples, while indicating preferred embodiments of the invention, aregiven by way of illustration only, since various changes andmodifications within the spirit and scope of the invention will becomeapparent to those skilled in the art from this detailed description.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a sectional view showing a semiconductor laser to which asorting method of the present invention is applied;

FIG. 2 is a chart showing light output characteristics of asemiconductor laser determined to be defective by the sorting methodaccording to an embodiment of the present invention;

FIG. 3 is a chart showing light output characteristics of asemiconductor laser determined to be non-defective by the sorting methodaccording to the embodiment of the present invention; and

FIG. 4 is a graph showing the relationship between the energization timeof a first current and a characteristic COD level.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

FIG. 1 is a sectional view showing the structure of a semiconductorlaser subjected to a sorting method of the present invention. Thisstructure will be briefly described. An Si-doped n-type GaAs bufferlayer 2, an Si-doped n-type GaInP cladding layer 3, a GaInAs activelayer 4, a Zn-doped p-type GaInP cladding layer 5, and a Zn-doped p-typeGaAs contact layer 6 are epitaxially grown on an Si-doped n-type GaAssubstrate 1. The GaInAs active layer 4 is constituted such that a GaInAsquantum well layer 4a is sandwiched between light confinement layers 4band 4c. The p-type GaAs contact layer 6 and the p-type GaInP claddinglayer 5 are mesa-etched as shown in FIG. 1. An SiN film 7 is formed onthe surface of the resultant structure except for the top portion of themesa. A p-side electrode 8 is formed on the resultant structure, and ann-side electrode 9 is formed on the lower surface of the GaAssubstrate 1. The width of a stripe is 5 μm at the bottom portion of themesa, and the length of a resonator is 1 mm. The p-side electrode 8 andthe contact layer 6 are removed by a length of about 20 μm from aportion near the end face, thereby preventing easy flow of a current.This structure allows a slow decrease in the COD level. Alight-reflecting film having a low reflectance of 5% is formed on thefront surface of this chip, and a light-reflecting film having areflectance of 90% is formed on the rear surface.

A sorting method according to an embodiment of the present inventionapplied to this semiconductor laser will be described below. Assume thatthe maximum rated current of the semiconductor lasers subjected tosorting is, e.g., 300 mA. The maximum rated current means the maximumvalue of a driving current for guaranteeing the use of the semiconductorlaser. The maximum rated current is one of design specifications.

First of all, a first current of 275 mA, which corresponds to 91.7% themaximum rated current, is supplied at 50° C. for 100 hours. Thereafter,a second current of 485 mA, which corresponds to 161.7% the maximumrated current, is supplied at room temperature for several seconds.Semiconductor lasers destroyed in this process are removed, and theremaining lasers are acknowledged as non-defective devices.

FIGS. 2 and 3 are charts showing the light output characteristics of adefective sample and a non-defective sample, respectively. Referring toFIGS. 2 and 3, solid lines 11 and 13 represent measurement resultsbefore the first current is supplied, and chain lines 12 and 14represent measurement results after the first current is supplied. Inboth the measurements, the driving current was continuously changedwithin a range of 0 to 485 mA. Therefore, the measurement represented bythe chain line is one process of this embodiment for removing defectivesemiconductor lasers destroyed upon supplying the second current.

In the non-defective devices, as is apparent from FIG. 3, thecharacteristics are not so changed even after the first energization.Also in the defective devices, the characteristics are not so changedafter the first energization as far as the supplied current is as largeas two or three times the current in actual use, i.e., when the suppliedcurrent is as large as the maximum rated current by a few times.However, as the current is increased, a slight decrease in light outputafter the first energization is observed. When a current of about 420 mAwas supplied, the COD occurred to stop the laser oscillation. Thesemiconductor lasers destroyed upon supplying the second current areassumed to have been largely decreased in COD level upon the firstenergization, or originally low in COD level. Therefore, if thesesemiconductor lasers are determined to be non-defective and put to usebecause they are hardly degraded upon the first energization, thesemiconductor lasers are anticipated to be destroyed due to a suddendeath in use. To the contrary, for the semiconductor lasers notdestroyed by applying the sorting method of this embodiment, theprobability of sudden death is very low even if they are used for a longperiod of time. Note that the semiconductor lasers which exhibitdifference of 10% or more in light output between the start and the endof the first energization can be acknowledged as defective at thatpoint. The semiconductor lasers which exhibit great degradation incharacteristics although not completely destroyed upon the secondenergization are also preferably acknowledged as defective. Theenergization time of the second current must be a enough time forsemiconductor lasers having low COD level to be destroyed due to COD.According to experimental results, it's necessary that the secondcurrent is supplied for at least 1 micro-second.

In some samples, the optical outputs satulate due to heat generation atthe active layers. In such case, pulse current whose width is longerthan 1 micro-second is useful as a driving source. A pulse currentsource which can supply shorter than 1 micro-second width pulse currentis very expensive. And when the pulse width is shorter than 1micro-second, the samples may not destroy due to COD.

In this embodiment, the second current is set to 485 mA. However, whenthis current is increased, the average service life of the semiconductorlasers determined to be non-defective can be prolonged although theyield is decreased. The second current value should be determined inaccordance with the service life to be guaranteed and the fractiondefective, as in the first current value. Actually, however, this mustbe led out from the empirical rule. If data cannot be sufficientlyobtained, the following method can be effectively used. First of all,the current value which causes the COD is measured using some samplesobtained by the same processes as those used for the targetsemiconductor lasers. The second current value is set to 70% the averagevalue. If the semiconductor laser samples are not destroyed due to theCOD and their outputs are limited by thermal saturation, the secondcurrent is set to 80% the average value of the current for allowing themaximum output. The first current is set to 50% the second current. Thetemperature and the time of supplying the first current are set to 50°C. and 100 hours, respectively.

As described above, according to this embodiment, detective deviceswhich are not easily detected even by the accelerated degradationprocess by the first energization can be appropriately removed.

In the above embodiment, the second current is supplied at roomtemperature. However, when energization is performed at a lowertemperature, the light output is increased, so the second current valuecan be set to a lower value without changing the light output. In thiscase, an inexpensive current supplying apparatus can be expected to beused. In addition, in the above embodiment, one second current value isset for a plurality of samples to which the sorting method is applied,and this second current value is applied to all the target samples. Thesecond current value can be appropriately selected in accordance withthe to-be-sorted semiconductor lasers. Furthermore, in place of thefixed second current value, the second current may be supplied such thatthe light output is fixed. More specifically, the second current may besupplied such that a light output within a range of 120 to 250% themaximum rated light output (e.g., a light output of 130 mW) is obtained.Similarly, the first current may also be defined not by the current butby the light output.

According to experiments by the present inventors, when the firstcurrent was supplied within a range of 50 to 150% the maximum ratedcurrent for at least 50 hours, and the second current larger than thefirst current was supplied within a range of 120 to 250% the maximumrated current, a sufficient effect for removal of defective devices wasobtained.

The first current value and the energization time of the first currentwill be considered together with the experimental results. An uncoatedsemiconductor laser (its maximum rated current is 300 mA) having thestructure shown in FIG. 1 was mounted on a copper heat sink using goldtin with the substrate 1 side facing downward. In a coated device, thedegradation rate of the COD level is decreased. Therefore, when anuncoated device is used as in this experiment, the test is performed inseverer conditions. A current was supplied up to 500 mA at 25° C. or 50°C. to measure the characteristics, and initial defective devices (e.g.,devices having a very high threshold value) were removed. Theseremaining samples were divided into nine groups each including 7 to 8samples, and the energization test was performed using the first currentat 50° C. After a predetermined period of time, energization of thesamples was stopped. A current (second current) was supplied up to 500mA at 50° C. for a short period of time to measure the current vs. lightoutput characteristics. The first current and the energization time ofthe first current were as follows.

    ______________________________________                                        Current (mA) Energization time (hours)                                        ______________________________________                                        275          100                                                              275          400                                                              275          1033                                                             350           50                                                              350          300                                                              ______________________________________                                    

The COD level is decreased by this energization. Therefore, the deviceswhich were normally operated before energization even when a current of500 mA was supplied are destroyed due to COD. The Weibull distributionof the COD level was made to obtain the characteristic COD level. Thecharacteristic COD level means that the 1/e (e is the base of naturallogarithm) devices of all the samples have a value equal to or largerthan the level. In other words, when an operating current is supplied toall the samples such that an output at the characteristic COD level canbe obtained, (1-1/e) devices of the all samples are COD-destroyed. Notethat an m value of the Weibull distribution was about 13.

The result is shown in FIG. 4. Referring to FIG. 4, the energizationtime of the current is plotted along the abscissa, and thecharacteristic COD level is plotted along the ordinate. Thecharacteristic COD level before this energization is found to be 104 mWor more. This is because, before energization, few devices were degradedat a current of 500 mA or less, and the average output at a current of500 mA was 104 mW. If the first current is supplied to these samples,the COD level is largely decreased within the first 50 hours ofenergization not only when the current value is 275 mA but also it is350 mA. The characteristic COD level was 88 mW at both the suppliedcurrent values. The characteristic COD level after 50 hours is graduallydecreased at almost a predetermined rate in accordance with the currentvalue.

The dependency of the degradation rate of the characteristic COD levelon the current can be obtained from this data. When the degradation ratewas assumed to be proportional to a current value to the αth power, αwas about 10. That is

    log (dP.sub.cod /dt)=α log (I)-24.8

where P_(cod) represents a characteristic COD (mW), t represents a time(hours), I represents a current (mA), and log represents the naturallogarithm.

The second current will be considered below.

In the sample devices used in this experiment, the current for obtaininga light output of 50 mW at 50° C. was 200 mA. The degradation rate ofthe characteristic COD level at this time was assumed to be 2.0×10⁻⁴mW/h. From these data, for example, if this laser is used at 50° C. anda light output of 50 mA, it can be estimated that the COD destructionwill occur within 100,000 hours (about ten years). In this experiment, avalue of 1.71% was obtained. If this laser is used at room temperature,the degradation rate of the COD level is assumed to be lower than thatat 50° C., and the value of 1.71% is considered to be almost the worstvalue.

Therefore, when the second value is selected such that 1.71% or more,e.g., 5% of all the samples cause the COD destruction when they are usedin conditions corresponding to the output of 50 mW of an uncoated device(or milder conditions), the reliability of the remaining devices can beguaranteed.

As has been described above, by using the method of sorting thesemiconductor lasers of the present invention, semiconductor laserswhich reach the so-called sudden death in use can be appropriatelyremoved in advance. In other words, semiconductor lasers left after thesorting method of the present invention was used are stably operated fora long period of time at very high probability.

From the invention thus described, it will be obvious that the inventionmay be varied in many ways. Such variations are not to be regarded as adeparture from the spirit and scope of the invention, and all suchmodifications as would be obvious to one skilled in the art are intendedto be included within the scope of the following claims.

The basic Japanese Application No. 173249/1993 filed on Jul. 13, 1993and No. 151062/1994 filed on Jul. 1, 1994 are hereby incorporated byreference.

What is claimed is:
 1. A method of sorting semiconductor lasers,comprising:the first step of supplying a first predetermined current tosaid semiconductor lasers for a first predetermined time; the secondstep of supplying a second predetermined current which is larger thansaid first predetermined for a second predetermined time which isshorter than said first predetermined time of the first step; and thethird step of measuring light output characteristics after the secondstep and removing defective devices in accordance with a measurementresult.
 2. A method according to claim 1, wherein the second stepincludes the steps of measuring a relationship between the secondpredetermined current and a light output and using a measurement resultas the light output characteristics to be measured in the third step. 3.A method according to claim 1, wherein the third step includes the stepsof supplying a third predetermined current to said semiconductor lasersand determining and removing said semiconductor lasers as defective whena light output value at that time is smaller than a predetermined value.4. A method according to claim 1, wherein an ambient temperature in thefirst step is higher than room temperature (25° C.).
 5. A methodaccording to claim 1, wherein an ambient temperature in the second stepis lower than an ambient temperature in the first step.
 6. A method ofsorting semiconductor lasers, comprising:the first step of causing saidsemiconductor lasers to output a first light output having a firstpredetermined intensity for a first predetermined time; the second stepof causing said semiconductor lasers to output a second light outputhaving a second predetermined intensity which is larger than said firstpredetermined intensity for a second predetermined time shorter thansaid first predetermined time of the first step; and the third step ofmeasuring light output characteristics after the second step andremoving defective devices in accordance with a measurement result.
 7. Amethod according to claim 6, wherein the second step includes the stepsof, when the second light output is emitted, measuring a relationshipbetween a supplied current and the light output and using a measurementresult as the light output characteristics to be measured in the thirdstep.
 8. A method according to claim 6, wherein the third step includesthe steps of supplying a predetermined current to said semiconductorlasers and determining and removing said semiconductor lasers asdefective when a light output value at that time is smaller than apredetermined value.
 9. A method according to claim 6, wherein anambient temperature in the first step is higher than room temperature(25° C.).
 10. A method according to claim 6, wherein an ambienttemperature in the second step is lower than an ambient temperature inthe first step.
 11. A method of sorting semiconductor lasers,comprising:the first step of supplying a first predetermined current tosaid semiconductor laser for a first predetermined time; the second stepof causing said semiconductor lasers to output a first light outputhaving a first predetermined intensity which is larger than a lightintensity of said semiconductor lasers which is obtained in said firststep, said second step lasting for a second predetermined time which isshorter than said first predetermined time of the first step; and thethird step of measuring light output characteristics after the secondstep and removing defective devices in accordance with a measurementresult.
 12. A method according to claim 11, wherein the second stepincludes the steps of, when the first light output is emitted, measuringa relationship between a supplied current and the light output and usinga measurement result as the light output characteristics to be measuredin the third step.
 13. A method according to claim 11, wherein the thirdstep includes the steps of supplying a second predetermined current tosaid semiconductor lasers and determining and removing saidsemiconductor lasers as defective when a light output value at that timeis smaller than a predetermined value.
 14. A method according to claim11, wherein an ambient temperature in the first step is higher than roomtemperature (25° C.).
 15. A method according to claim 11, wherein anambient temperature in the second step is lower than an ambienttemperature in the first step.
 16. A method of sorting semiconductorlasers, comprising:the first step of causing said semiconductor lasersto output a first light output having a first predetermined intensityfor a first predetermined time; the second step of supplying a firstpredetermined current to said semiconductor laser, wherein said firstpredetermined current is larger than a current enabling saidsemiconductor lasers to issue said first predetermined intensity, saidsecond step lasting for a second predetermined time which is shorterthan said first predetermined time of the first step; and the third stepof measuring light output characteristics after the second step andremoving defective devices in accordance with a measurement result. 17.A method according to claim 16, wherein the second step includes thesteps of measuring a relationship between the supplied current and alight output and using a measurement result as the light outputcharacteristics to be measured in the third step.
 18. A method accordingto claim 16, wherein the third step includes the steps of supplying asecond predetermined current to said semiconductor lasers anddetermining and removing said semiconductor lasers as defective when alight output value at that time is smaller than a predetermined value.19. A method according to claim 16, wherein an ambient temperature inthe first step is higher than room temperature (25° C.).
 20. A methodaccording to claim 16, wherein an ambient temperature in the second stepis lower than an ambient temperature in the first step.